Copyright © 2018 MDM. All Rights Reserved   |   Created by AdvA studio

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Utilizing multi-dimensional metrology to control semiconductor wafer production.

MDM - Multi Dimensional Metrology an Israeli MAGNET consortium

Multi-Dimensional Metrology (MDM) Annual Conference

Sponsored by the MAGNET Program of the Israel Innovation Authority


20 December 2018
Applied Material, Rehovot - Israel

What?

When?

How?

The MDM consortium's goal is to bridge the gap between current metrology technologies and those which will be needed in the future.  As the nodes shrink beyond 5nm, current technologies will no longer be able to differentiate between what looks like a defect (false positive) and an actual defect of interest, which will change the way a chip will function.

 

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The industry is already seeing limits of standard optical systems to resolve very small defects.  Within just a coupe of years, the existing technologies will not be relevant unless we update the capabilities with fundamental jumps in the approach we take.

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We are researching novel methods for measuring a) the materials comprising the semiconductor layers b) new concepts such as CREM, ULF Raman, etc. which can provide information not generally used today c) consolidation of data from a variety of existing metrology methods into a single view of the data, thereby bringing the whole to be greater than the sum of the parts and d) improving by orders of magnitude the existing metrology capabilities by dealing with accuracy issues.

 

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MDM is an Israeli Innovation Authority consortium which is cooperating with international research bodies and consortia, including several European projects. MDM welcomes additional cooperation with similar bodies around the world.

Around the world

Industrial  Members

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Academic Members

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Work Packages

Researching and developing new metrology methods and solutions for characterization and analysis of material properties, including composition, stress, crystallinity, doping, crystal phase, work function, etc.

WP1

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Researching next generation imaging concepts to find defects on wafers, including extending the capability of optical inspection methods, and introducing novel imaging techniques.

Beyond
Imaging Limits

WP2

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Utilizing advanced computing technologies to improve classification of defects, Also, taking advantage of Big Data to correlate between different types of measuring methods to improve the defect detection.

Machine Learning & Data Processing

WP3

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Improving precision and accuracy of the measuring methods in order to better emit and read the signals.

Precision
& Accuracy

WP4

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