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Multi-Dimensional Metrology (MDM) Annual Conference

Sponsored by the MAGNET Program of the Israel Innovation Authority


20 December 2018
Applied Materials, Rehovot - Israel

The MDM consortium cordially invites you to join its annual conference.

 

Hear first-hand the highlights of the consortium activities and join us in discussing concepts and approaches for metrology to deal with emerging challenges of the semiconductor industry.

The MDM Consortium deals with development of measurement and process control technologies in the semiconductor industry, based on data fusion from many sources.

A chip miniaturization process culminating in 5 nanometer geometries and the transition to building 3D structures creates new challenges requiring innovative process control methods. Multi-Dimensional Metrology’s goal is to enable integration of different types of information sources from various measuring devices in order to meet that challenge. 

Agenda:

Time
Topic
08:45
Registration
09:30
Welcome & MDM Overview
Dr. Dony Meshulach, MDM Chairman
09:45
Israel Innovation Authority – Magnet Program
Dr. Aviv Zeevi Balasiano, Head of Technological Infrastructure Division, Israel Innovation Authority
09:55
Why are we here today?
Dr. Andy Sharon, MDM Manager, Israel Innovation Authority
10:05
Industry Overview
Dr. Dony Meshulach, Director of Technology and Strategic Collaborations, Applied Materials
10:25
Metrology challenges in the era of multi-dimensional devices, EUV lithography, and advanced multi patterning
 
Mr. Ofer Adan, Director of Patterning Control Technology, Applied Materials
10:55
WP 1 - Material & Dimensional Metrology (from LAB to FAB)
Mr. Yovav Kalifon, Technology Partnership Programs, CTO Division, Nova
11:15
Device characterization using Chemically Resolved Electrical Measurements (CREM)
Dr. Hagai Cohen, Weizmann Institute of Science
11:30
Raman scattering for material & dimensional metrology
Prof. Yaakov Tischler, Bar Ilan University
11:45
Coffee Brake
Poster session
12:15
WP2 – New Imaging Methods for Inspection and Metrology
Dr. Haim Feldman, Senior Physicist, Applied Materials
12:35
Three dimensional defect detection by optical point spread function engineering
Prof. Yoav Shechtman, Technion
12:50
Enhancing 3D metrology with TEM tomography
Prof. Tamar Segal- Peretz, Technion
13:05
Lunch 
Posters Session
14:00
Sub 10 nm interconnects, process technology and metrology issues
Prof. Yosi Shacham, Tel Aviv University
14:30
WP3 - Machine Learning and Big Data in Multi Dimension Metrology
Dr. Barak Bringoltz, Director of Modeling, NOVA
14:50
AI-enabling realtime data infrastructure for Metrology
Mr. Ilan Golberg, Innovation & Research Programs, Dell EMC
15:05
Big Data Management in MDM
Prof. Tova Milo, Tel Aviv University
15:20
Coffee Break 
Poster Session
15:40
WP4 – Multi-Dimensional Sensing for sub 1 nm metrology Stability
Dr. Roman Yasinov, Physics Expert, Nanomotion
16:00
A miniature ultrasensitive magnetic sensor for magnetic noise suppression
Prof. Lior Klein, Bar-Ilan University
16:15
Towards a Multi-dimensional FM AFM using auto-resonance
Prof. Izhak Bucher, Technion
16:30
Quantum computers: The dawn of a new technological era
Emeritus Professor Joseph Avron, Physics department, Technion
17:00
MDM Awards and Conference Summary
Dr. Dony Meshulach, MDM Chairman

Address:

4 Bergman St., Rehovot

Applied Materials Israel  |  Plank Hall

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